Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

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Witgain Technology Limited

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Name: Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free
Brand: WITGAIN PCB
Price: 1 USD

Brand Name : WITGAIN PCB

Model Number : PCB000372

Certification : UL

Place of Origin : China

MOQ : 1pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100kpcs/Month

Delivery Time : 10 days

Packaging Details : Vacuum package in bubble wrap

Layer Count : 2 Layer

Copper Thickness : 35 UM

Drawing File Format : Gerber or PCB

Solder Mask Ink : Green

Min Trace : 7 mil

Finished Thickness : 1.2 MM

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Printed Circuit Boards 2 Layer PCB With HAL Lead Free

PCB Specifications:

1 2 Layer FR4 substrate material printed circuit board.

2 Double layer copper, copper thickness is 35um/35um.

3 Finished pcb thickness is 1.2mm.

4 2 layer pcb with 4/4mil min line space and width.

5 Green solder mask and white silkscreen.

6 Need customer to send us the gerber file or PCB file

7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

S1130 Data Sheet:

S1130
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	135
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	310
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	65
			After Tg	ppm/℃	310
			50-260℃	%	4.5
T260		IPC-TM-650 2.4.24.1	TMA	min	13
T288		IPC-TM-650 2.4.24.1	TMA	min	<1
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	60S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	4.8E + 08
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.6E + 06
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	5.2E + 07
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	5.3E + 06
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	120
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	60
Electrical Strength		IPC-TM-650 2.5.6.2	D-48/50+D-4/23	kV/mm	—
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.6
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.016
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength(1oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.8
			125℃	N/mm	1.6
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	600
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	500
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.15
CTI		IEC30112	C-48/23/50,	℃	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Multilayer PCB Process:

Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

Product Tags:

2 Layer Printed Electronic Circuit Board

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